Subsequent 12 months’s iPhone 18 will use TSMC’s next-generation 2-nanometer fabrication course of together with a complicated new packaging technique, and the world’s main pure-play foundry has reportedly already established a devoted manufacturing line for Apple in anticipation of mass manufacturing in 2026.
In response to earlier stories, Apple’s A20 chip in iPhone 18 fashions will swap from the earlier InFo (Built-in Fan-Out) packaging to WMCM (Wafer-Degree Multi-Chip Module) packaging. Technically, the variations between the 2 packaging strategies are fairly hanging.
InFo permits integration of parts, together with reminiscence, throughout the bundle however focuses extra on single-die packaging the place reminiscence is often connected to the principle SoC (reminiscent of DRAM positioned on high or close to the CPU and GPU cores). It is optimized for decreasing the scale and enhancing the efficiency of particular person chips.
WMCM, alternatively, excels at integrating a number of chips throughout the identical bundle (therefore the “Multi-Chip Module” half). This technique permits extra complicated programs, reminiscent of CPUs, GPUs, DRAM, and different customized accelerators (e.g., AI/ML chips) to be tightly built-in in a single bundle. It offers higher flexibility in arranging various kinds of chips, stacking them vertically or putting them aspect by aspect, whereas additionally optimizing communication between them.
TSMC plans to begin manufacturing 2nm chips in late 2025, and Apple is predicted to be the primary firm to obtain chips constructed on the brand new course of. TSMC usually builds new fabs when it wants to extend manufacturing capability to deal with vital orders for chips, and TSMC is increasing in a serious approach for 2nm know-how.
To serve its main shopper Apple, TSMC has established a devoted manufacturing line at its Chiayi P1 fab, the place WMCM packaging month-to-month capability is predicted to succeed in 10,000 models by 2026, stories DigiTimes. In response to Apple analyst Ming-Chi Kuo, solely “Professional” fashions within the iPhone 18 collection are seemingly to make use of TSMC’s next-generation 2nm processor know-how due to value considerations. Kuo additionally believes that the iPhone 17 Professional will characteristic 12GB of RAM on account of the brand new packaging technique.
Phrases like “3nm” and “2nm” describe generations of chip manufacturing know-how, every with its personal set of design guidelines and structure. As these numbers lower, they often point out smaller transistor sizes. Smaller transistors enable extra to be packed onto a single chip, sometimes leading to elevated processing velocity and improved energy effectivity.
Final 12 months’s iPhone 16 collection relies on an A18 chip design constructed utilizing a second-generation “N3E” 3nm course of. In the meantime, this 12 months’s upcoming iPhone 17 lineup is predicted to make use of A19 chip know-how that is seemingly constructed on an upgraded 3-nanometer course of referred to as “N3P.” In comparison with earlier variations of 3nm chips, the N3P chips provide elevated efficiency effectivity and elevated transistor density.
